New Product Announcements

American Portwell Technology
Table: 7

PORTWELL FURTHERS ITS TYPE 6 COM EXPRESS™ MODULE PORTFOLIO New PCOM-B217VG-VI-ECC features second-generation Intel® Core i7/i5 quad-/dual-core processors with ECC RAM support for new carrier board designs

The PCOM-B217VG-VI-ECC module features an error-correcting ECC memory controller for higher system and data reliability, and Turbo Boost Technology 2.0 which dynamically increases the operating frequency of processor cores beyond baseline levels – even beyond 3GHz – according to workload and real-time power and temperature measurements. This frequency increase is complementary to hyperthreading, which raises the performance of multi-threaded and single threaded applications. The processor-integrated graphics engine supports high-end media/graphics capabilities and delivers greater graphics performance while reducing overall platform power requirements. Portwell’s PCOM-B217VG-VI-ECC module is well suited for gaming machines, high-end communications applications, test equipment, streaming video terminals, and medical imaging devices.

Product details

Axiomtek
Table: 3

Axiomtek CAPA800 3.5-inch embedded board based on the Intel® Atom™ processors N450, D410 and D510, implemented in 45nm technology, is power-optimized and delivers great performance per watt at an affordable price. It is a great choice for customers who need an embedded board featuring more compact, fanless, cost-effective, and low-power,” said Michelle Mi, Product Manager of Embedded Board and Technology Business Unit at Axiomtek. “In addition to performance and I/O-rich, the CAPA800's full graphics feature makes it a perfect solution for digital signage, self-serve terminal, thin clients, and digital surveillance.

The CAPA800 delivers high-bandwidth expansion capability with one PCI Express Mini card for custom system configurations. To satisfy increasing demands of connecting more peripheral devices, the CAPA800 provides eight USB 2.0 ports and two serial ATA ports with transfer rates up to 3Gb/s. Other onboard I/O features include four COM ports (3 x RS-232 & 1 x RS-232/422/485), dual Gigabit LANs, CompactFlash™, and HD audio. Besides, the low-power embedded board supports Windows® 7, Windows® Vista, Windows® XP embedded, and Linux.

Axiomtek will showcase its COM Express Module CEM860 that includes the following features:

Intel® Quad/Dual Core™ 17 / i5 processor
Intel® PCH QM67
DDR3-1066/1333 SO-DIMMs max. up to 16 GB
22 lanes of PCie gen 2 at 5GT/s
2 x SATA-600 & 2 SATA-300
8 x USB 2.0 ports
2 x USB 3.0 ports (optional)
TPM (optional)

PICMG1.3 SBC supports Intel® Core™ i7/ i5/ i3, designed for server-class performance without sacrificing cost or reliability for Medical, Military, Gaming, and Factory Automation Applications – SHB106

Axiomtek’s newest SHB106 is a mainstream platform designed for the new Intel® Core™ i7/ i5/ i3 processors, which provides extreme computing and high bandwidth along with great energy efficiency. All three Intel® Core™ processors have built-in memory and graphics controllers and offer Turbo Boost feature and Hyper-Threading technology that can scale clock speeds upon demand. Moreover, the built-in iAMT 7.0 and TPM 1.2 gives users the ability to enhance security and remotely access for ease of maintenance," said Eric Chiang, Product Manager of Product & Marketing Division at Axiomtek. “The SHB106 meets all current requirements for Windows® 7, satisfying demanding needs in today’s industrial work environment.

congatec
Table: 1

conga-BM57 delivers maximum computing performance paired with highest graphics speed from the integrated graphics controller. congatec AG extends its COM Express product family with the highest performance module conga-BM57. It features the latest Intel® Core™ i7-620M processor with a core speed of 2.66 GHz, with 4 MByte L2 cache and up to 8 GByte fast (1066 MT/s) dual channel DDR3 memory. The congaBM57 is a two chip solution which utilizes the powerful Mobile Intel® QM57 Express Chipset. The integrated graphics controller is supporting the Intel® Flexible Display Interface (FDI) in order to allow for two independent video channels on VGA, LVDS, HDMI, DisplayPort or SDVO interfaces.

conga-BAF, a new COM Express basic module, offers outstanding graphics performance with low power consumption. conga-BAF is based on the AMD Embedded G-Series platform. The integration of AMD Fusion technology expands the COM Express standard with a completely new processor architecture that combines processors and graphics cores in a compact package. System designers benefit from a powerful CPU and an even more powerful graphics performance, excellent performance-per-watt ratio and flexible task allocation on the CPU and GPU. With the conga-BAF, streaming high-definition multimedia content and playing the latest next generation 3D games becomes easy and straightforward.

conga-EAF module provides broad scalability for ETX standard.
The conga-EAF module guarantees a sustainable future and broad scalability for the ETX standard. With a choice of seven AMD G-Series processors, the conga-EAF also offers the best price/performance ratio. A particularly noteworthy benefit of the new COMs is native PCI support. ETX applications are based on this primary data bus and therefore continue to rely on unlimited data transfer for the connection of PCI peripherals. Direct native 32-bit PCI support from the chipset has substantial advantages with regard to PCI bus latency over comparable PCI Express bridge solutions.

conga-CA6 offers low power consumption with impressive graphics performance, even in the extended temperature range. conga-CA6 is based on the new Intel® Atom™ E6xx processor series and the Intel® Platform Controller Hub EG20 for COM Express Type 2. All components of this embedded design are specified for the industrial temperature range of -40 to +85°C, making the conga-CA6 an ideal solution for extreme applications. With a power consumption of less than 5 Watt and a compact size of 95 x 95 mm, the new computer-on modules are an excellent fit for applications in the medical and automation sector. In portable devices, long battery life as a result of optimized power consumption and battery management is a direct cost saving factor.

Congatec’s COM Express Compact mini carrier board enables quick design-in. The conga-MCB is a mini carrier board for COM Express Compact modules that is perfect for space-critical applications. It is ideal for the quick construction of prototypes but can also be used for high performance mobile applications. The easily integrated mini carrier board is only 145 x 95 mm with various interfaces based on the latest standards and can accelerate the evaluation phase of the design-in to ensure a rapid market introduction.

conga-BM67 is based on one of Intel's latest mobile quad-core processors supported for the embedded market. Another member of the Intel® processor-based COM Express product family, it is the highest performance module. It features the latest 2nd Generation Intel® Core™ processors such as the Intel® Core™ i7-2710QE processor (2.1 GHz, 45W, PGA) and the dual-core Intel® Core™ i5-2510E processor (2.5 GHz, 35W, PGA) with up to 8 GByte dual channel DDR3 memory (1333 MHz). The conga-BM67 is a two chip solution that utilizes the new powerful Intel® QM67 Express chipset.

conga-BE57, a COM Express Basic Module with ECC Support, provides a memory error correction feature, which ensures maximum reliability. Designed for DDR3 ECC SODIMM memory modules and equipped with extremely low power Intel® processors in a BGA package, the conga-BE57 is particularly suitable for mission critical applications. Unlike ordinary RAM modules, ECC modules offer additional functionalities allowing them to check and control the flow of data and therefore correct errors. This type of memory module can detect and correct singl- bit errors as well as detect multi-bit errors. Due to this increased reliability, they are ideal for demanding applications in medical technology, server systems and aviation.